Flip chip with integrated mask and underfill
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United States of America Patent
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N/A
Issued Date -
Aug 30, 2001
app pub date -
May 8, 2001
filing date -
Apr 27, 1998
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A flip chip having solder bumps, an integrated underfill, and a separate flux coating, as well as methods for making such a device, is described. The device is characterized in that the underfill material is provided on the chip surface prior to the application of solder bumps, and then treated to form apertures therein which act as a mask for solder bump application. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes which heretofore have required a separate underfilling step.
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