Wafer plating apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Aug 30, 2001
app pub date -
Feb 26, 2001
filing date -
Feb 28, 2000
priority date (Note) -
Abandoned
status (Latency Note)
![]() |
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
![]() |
Next PAIR Update Scheduled on [ ] |

Importance

US Family Size
|
Non-US Coverage
|
Abstract
The present invention provides a technique for removing air remaining on the peripheral edge of a surface to be plated in a conventional wafer plating apparatus, and to provide a wafer plating apparatus capable of performing a more uniform plating up to the peripheral edge of the surface to be plated, and which is further capable of performing plating even with respect to a wafer coated with a seed metal. This wafer plating apparatus includes a wafer clamp 6 for holding a wafer 4, a wafer support member 7 for supporting the periphery of the surface 5 to be plated of the wafer 4, and a plating tank 2 for circulating a plating solution while making the plating solution overflow from an upper opening of the tank. The wafer plating apparatus is arranged so as to perform plating, while the surface 5 to be plated is laid face down, being in contact with the surface of the plating solution, in a state in which the wafer 4 is clamped by the wafer clamp 6 and the wafer support member 7. In this wafer plating apparatus, the wafer support member 7 is equipped with air-vent holes 12 for discharging air remaining on the peripheral edge of the surface 5 to be plated while the surface of the plating solution and the wafer 4 are made contact with each other.
First Claim
all claims..Other Claims data not available
Family
Country | kind | publication No. | Filing Date | Type | Sub-Type |
---|---|---|---|---|---|
JP | A | JP2001234394 | Feb 28, 2000 | Patent | Application |
Type : Patent Sub-Type : Application | |||||
Published unexamined patent application | WAFER PLATING DEVICE | Aug 31, 2001 |
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
ELECTROPLATING ENGINEERS OF JAPAN LIMITED | 6-6 NIHOMBASHI KAYABACHO 2-CHOME CHUO-KU TOKYO | |
TOKYO ELECTRON EE LIMITED | TBS BROADCASTING CENTER 3-6 AKASAKA 5-CHOME MINATO-KU TOKYO 107-8491 |
International Classification(s)

- 2001 Application Filing Year
- B05C Class
- 518 Applications Filed
- 142 Patents Issued To-Date
- 27.42 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Harima, Yoshiyuki | Tsukui-gun, JP | 6 | 92 |
# of filed Patents : 6 Total Citations : 92 | |||
Ishida, Hirofumi | Atsugi-shi, JP | 20 | 471 |
# of filed Patents : 20 Total Citations : 471 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 2 Citation Count
- B05C Class
- 4.79 % this patent is cited more than
- 24 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
- No Legal Status data available.

Matter Detail

Renewals Detail
