Wafer plating apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20010017105A1
SERIAL NO

09791841

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Abstract

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The present invention provides a technique for removing air remaining on the peripheral edge of a surface to be plated in a conventional wafer plating apparatus, and to provide a wafer plating apparatus capable of performing a more uniform plating up to the peripheral edge of the surface to be plated, and which is further capable of performing plating even with respect to a wafer coated with a seed metal. This wafer plating apparatus includes a wafer clamp 6 for holding a wafer 4, a wafer support member 7 for supporting the periphery of the surface 5 to be plated of the wafer 4, and a plating tank 2 for circulating a plating solution while making the plating solution overflow from an upper opening of the tank. The wafer plating apparatus is arranged so as to perform plating, while the surface 5 to be plated is laid face down, being in contact with the surface of the plating solution, in a state in which the wafer 4 is clamped by the wafer clamp 6 and the wafer support member 7. In this wafer plating apparatus, the wafer support member 7 is equipped with air-vent holes 12 for discharging air remaining on the peripheral edge of the surface 5 to be plated while the surface of the plating solution and the wafer 4 are made contact with each other.

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Patent Owner(s)

Patent OwnerAddress
ELECTROPLATING ENGINEERS OF JAPAN LIMITED6-6 NIHOMBASHI KAYABACHO 2-CHOME CHUO-KU TOKYO
TOKYO ELECTRON EE LIMITEDTBS BROADCASTING CENTER 3-6 AKASAKA 5-CHOME MINATO-KU TOKYO 107-8491

International Classification(s)

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  • 2001 Application Filing Year
  • B05C Class
  • 518 Applications Filed
  • 142 Patents Issued To-Date
  • 27.42 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2001200220032004200520062007200820092010201120120255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Harima, Yoshiyuki Tsukui-gun, JP 6 92
Ishida, Hirofumi Atsugi-shi, JP 20 471

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  • 2 Citation Count
  • B05C Class
  • 4.79 % this patent is cited more than
  • 24 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges910646167111101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6071 - 80100 +05101520253035404550556065707580859095100105110115

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