Slurry for chemical mechanical polishing
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United States of America Patent
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N/A
Issued Date -
Jun 28, 2001
app pub date -
Dec 28, 2000
filing date -
Dec 28, 1999
priority date (Note) -
Abandoned
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Abstract
In chemical mechanical polishing of a copper metal film, contamination of a polishing pad may be prevented by using a slurry for chemical mechanical polishing consisting of .theta.-alumina which mainly comprises secondary particles made of aggregated primary particles as polishing grains.
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