Flip chip with integrated flux and underfill
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
Jun 7, 2001
app pub date -
Dec 6, 2000
filing date -
Mar 10, 1999
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A flip chip having solder bumps and an integrated flux and underfill, as well as methods for making such a device, is described. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes which heretofore have required separate fluxing and underfilling steps.
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