Method and device for removing deposits from the ends of contacting needles of semiconductor test devices and use of a substrate for this purpose
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Jun 7, 2001
app pub date -
Dec 6, 2000
filing date -
Dec 6, 1999
priority date (Note) -
Abandoned
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Abstract
The device for removing bond pad material deposits adhering to the ends of contacting needles for contacting the bond pads of a die is provided with a substrate having an adhesive upper side adapted to be contacted by the ends of the contacting needles and being configured such that the adhesive force between the deposits and the upper side of the substrate is larger than the adhesive force between the deposits and the ends of the contacting needles.
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