Flip chip with integrated flux and underfill
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United States of America Patent
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app pub date -
Dec 21, 2000
filing date -
Apr 27, 1998
priority date (Note) -
Abandoned
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Abstract
A flip chip having solder bumps, an integrated underfill, and a separate flux coating, as well as methods for making such a device, is described. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes which heretofore have required a separate underfilling step.
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