Heat dissipation assembly

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12267984
APP PUB NO 20230171917A1
SERIAL NO

17990373

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A heat dissipation assembly is disclosed and includes a frame and a fan. The frame includes a heat conduction channel and an airflow intake. The heat conduction channel is communication with an exterior through airflow intake. The frame includes a first plane, a second plane and an inclined plane. The first plane is disposed adjacent to the airflow intake. The inclined plane is connected between the first plane and the second plane. The second plane includes an inlet. The heat conduction channel is in communication between the airflow intake and the inlet. A cross-section area of the heat conduction channel adjacent to the airflow intake is greater than that of the heat conduction channel adjacent to the inlet. The fan is spatially corresponding to the inlet, and assembled with the frame to form an outlet in communication with the airflow intake and the heat conduction channel through the inlet.

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Patent Owner(s)

Patent OwnerAddress
DELTA ELECTRONICS INCNO 252 SHANYING RD GUISHAN DIST TAOYUAN CITY 333

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chih-Chung Taoyuan, TW 124 1645
Chen, Meng-Yu Taoyuan, TW 24 115
Hsu, Kuo-Tung Taoyuan, TW 24 121
Wang, Yi-Han Taoyuan, TW 15 55
Yang, Chao-Fu Taoyuan, TW 29 95

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