Capacitors and resistors at direct bonding interfaces in microelectronic assemblies
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United States of America
Stats
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Apr 1, 2025
Grant Date -
Mar 24, 2022
app pub date -
Sep 18, 2020
filing date -
Sep 18, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed herein are capacitors and resistors at direct bonding interfaces in microelectronic assemblies, as well as related structures and techniques. For example, in some embodiments, a microelectronic assembly may include a first microelectronic component and a second microelectronic component, wherein a direct bonding interface of the second microelectronic component is direct bonded to a direct bonding interface of the first microelectronic component, the microelectronic assembly includes a sensor, the sensor includes a first sensor plate and a second sensor plate, the first sensor plate is at the direct bonding interface of the first microelectronic component, and the second sensor plate is at the direct bonding interface of the second microelectronic component.
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