Semiconductor package and method of forming the same
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United States of America
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Apr 1, 2025
Grant Date -
Oct 13, 2022
app pub date -
Jun 29, 2022
filing date -
Jun 29, 2022
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Abstract
A semiconductor package includes electric integrated circuit dies, photoelectric integrated circuit dies, and an inter-chip waveguide. The electric integrated circuit dies are laterally encapsulated by a first insulating encapsulant. The photoelectric integrated circuit dies are laterally encapsulated by a second insulating encapsulant. Each one of photoelectric integrated circuit dies includes an optical input/output terminal. The inter-chip waveguide is disposed over the second insulating encapsulant, wherein the photoelectric integrated circuit dies are optically communicated with each other through the inter-chip waveguide.
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