Semiconductor device package having dummy dies

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12266635
APP PUB NO 20220384390A1
SERIAL NO

17817705

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Abstract

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A semiconductor device package is provided. The semiconductor device package includes a substrate, a first package component, a second package component, and at least one dummy die. The first and second package components are disposed over and bonded to the substrate. The first and second package components are different types of electronic components that provide different functions. The dummy die is disposed over and attached to the substrate. The dummy die is located between the first and second package components and is electrically isolated from the substrate.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDNO 8 LI-HSIN ROAD 6 HSINCHU SCIENCE PARK HSINCHU 300

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jeng, Shin-Puu Hsinchu, TW 851 18082
Lai, Po-Chen Hsinchu, TW 76 18
Lin, Po-Yao Zhudong Township, TW 271 1156
Yang, Che-Chia Taipei, TW 39 20
Yeh, Shu-Shen Taoyuan, TW 165 129
Yew, Ming-Chih Hsinchu, TW 158 1091

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