Vertically mounted die groups

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12266634
APP PUB NO 20240014172A1
SERIAL NO

18473273

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Abstract

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A method of fabricating a semiconductor package includes: providing a first die group including a plurality of first dies stacked parallel to a front surface of the first die group; providing a second die group including a plurality of second dies parallel to a front surface of the second die group; providing a base substrate structure comprising a substrate characterized by a lattice crystalline plane extending in a third direction; bonding the first die group on the base substrate structure, wherein the first edge extends in a first direction, and the first direction and the third direction define a first angle; and bonding the second die group on the base substrate structure, wherein the second edge extends in a second direction, and the second direction and the third direction define a second angle, and at least one of the first angle and the second angle is not zero.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSINCHU 300-78

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Jen-Yuan Hsinchu, TW 175 215

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