Package process and package structure

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12266632
APP PUB NO 20220157775A1
SERIAL NO

17573593

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Importance

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Abstract

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A package structure includes: 1) a circuit substrate; 2) a first semiconductor device disposed on the circuit substrate; 3) a first insulation layer covering a sidewall of the first semiconductor device; 4) a second insulation layer covering the first insulation layer; and 5) a third insulation layer disposed on the circuit substrate and in contact with the second insulation layer.

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Patent Owner(s)

Patent OwnerAddress
ADVANCED SEMICONDUCTOR ENGINEERING INC26 CHIN 3RD ROAD NANZIH DIST KAOHSIUNG 811

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Jen-Chuan Kaohsiung, TW 22 681
Pan, Tommy Kaohsiung, TW 8 187
Shen, Chi-Chih Kaohsiung, TW 45 715

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