Molded laser package with electromagnetic interference shield and method of making
Number of patents in Portfolio can not be more than 2000
United States of America
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Apr 1, 2025
Grant Date -
May 18, 2023
app pub date -
Jan 18, 2023
filing date -
Jan 18, 2023
priority date (Note) -
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Abstract
A semiconductor device has a substrate comprising a carrier and an interposer disposed on the carrier. An electrical component is disposed over a first surface of the interposer. An interconnect structure is disposed over the first surface of the interposer. An encapsulant is deposited over the electrical component, interconnect structure, and substrate. A trench is formed through the encapsulant and interposer into the carrier. A shielding layer is formed over the encapsulant and into the trench. The carrier is removed after forming the shielding layer.
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