Semiconductor package device and method for manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12266610
APP PUB NO 20230005841A1
SERIAL NO

17942984

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Abstract

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A semiconductor package device and a method of manufacturing a semiconductor package device are provided. The semiconductor package device includes a substrate, a first electronic component, a first dielectric layer, and a first hole. The substrate has a first surface and a second surface opposite to the first surface. The first electronic component is disposed on the first surface. The first dielectric layer is disposed on the second surface and has a third surface away from the substrate. The first hole extends from the first dielectric layer and the substrate. The first hole is substantially aligned with the first electronic component.

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Patent Owner(s)

  • ADVANCED SEMICONDUCTOR ENGINEERING, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kuo, Yencheng Kaohsiung, TW 2 0
Yang, Shao-Lun Kaohsiung, TW 12 7

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