Semiconductor device and method for advanced thermal dissipation
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United States of America
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Apr 1, 2025
Grant Date -
Dec 14, 2023
app pub date -
Jun 8, 2022
filing date -
Jun 8, 2022
priority date (Note) -
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Abstract
A semiconductor device has a substrate and a semiconductor die disposed over the substrate. A tape is disposed over the semiconductor die. An encapsulant is deposited over the substrate, semiconductor die, and tape. The tape is removed to leave a cavity in the encapsulant over the semiconductor die. A shielding layer is formed over the encapsulant and semiconductor die. A heat spreader is disposed over the shielding layer. The heat spreader includes a protrusion extending into the cavity of the encapsulant.
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