Communicating data with stacked memory dies

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12265489
APP PUB NO 20240004814A1
SERIAL NO

18369622

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Abstract

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Methods, systems, and devices for communicating data with stacked memory dies are described. A first semiconductor die may communicate with an external computing device using a binary-symbol signal including two signal levels representing one bit of data. Semiconductor dies may be stacked on one another and include internal interconnects (e.g., through-silicon vias) to relay an internal signal generated based on the binary-symbol signal. The internal signal may be a multi-symbol signal modulated using a modulation scheme that includes three or more levels to represent more than one bit of data. The multi-level symbol signal may simplify the internal interconnects. A second semiconductor die may be configured to receive and re-transmit the multi-level symbol signal to semiconductor dies positioned above the second semiconductor die.

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Patent Owner(s)

Patent OwnerAddress
LODESTAR LICENSING GROUP LLC1603 ORRINGTON AVE SUITE 600 EVANSTON IL 60201

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gans, Dean D Nampa, US 105 604
Hasbun, Robert Nasry San Jose, US 39 459
Hollis, Timothy M Meridian, US 159 1841
Wright, Jeffrey P Boise, US 136 2852

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