Resonant device improvement in PICs using spare devices to reduce power requirements
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United States of America
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Apr 1, 2025
Grant Date -
Mar 10, 2022
app pub date -
Sep 1, 2021
filing date -
Sep 1, 2021
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Abstract
A Photonic Integrated Circuit (PIC) includes N Ring and Disk type Microstructures (RDMs), N is an integer and greater than 1; at least one spare RDM, wherein each RDM operates spectrally in a periodic nature and has its spectral operation vary by temperature; and circuitry configured to handoff any of the N RDMs and the at least one spare RDM for spectral operation based on a current temperature. For the handoff, the at least one spare RDM is unlocked spectrally and is tuned and locked to a frequency of interest of a current RDM based on the temperature, and the current RDM is unlocked.
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