Cu—Ni—Si based copper alloy plate, Cu—Ni—Si based copper alloy plate with plating film, and methods of producing the same
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United States of America
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Apr 1, 2025
Grant Date -
May 11, 2023
app pub date -
Mar 12, 2021
filing date -
Mar 12, 2021
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Abstract
A Cu—Ni—Si based copper alloy containing Ni and Si: in a center portion in a plate thickness direction, containing 0.4% by mass or more and 5.0% by mass or less of Ni, 0.05% by mass or more and 1.5% by mass or less of Si, and the balance Cu and inevitable impurities; where an Ni concentration on a plate surface is 70% or less of a center Ni concentration in the thickness center portion; a surface layer portion having a depth from the plate surface to be 90% of the center Ni concentration; in the surface layer portion, the Ni concentration increases from the plate surface toward the thickness center portion at 5.0% by mass/μm or more and 100% by mass/μm or less of a concentration gradient; to improve the electric connection reliability under high-temperature environment.
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