Control device for laser annealing apparatus and laser annealing method

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12263537
APP PUB NO 20230120514A1
SERIAL NO

18067121

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Abstract

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A control device for controlling an annealing apparatus that performs laser annealing by causing a laser beam to be incident on a surface of a semiconductor wafer and moving a beam spot of the laser beam on the surface of the semiconductor wafer, the control device making a sweep speed of the beam spot of the laser beam faster than twice a value obtained by dividing a thermal diffusivity of the semiconductor wafer by a thickness of the semiconductor wafer.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO HEAVY INDUSTRIES LTDTOKYO JAPAN TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Okada, Yasuhiro Yokosuka, JP 64 1199
Yorozu, Masafumi Yokosuka, JP 3 2

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