Integration techniques for micromachined pMUT arrays and electronics using thermocompression bonding, eutectic bonding, and solder bonding

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12263507
APP PUB NO 20210086231A1
SERIAL NO

17095333

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Abstract

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The present disclosure provides methods to integrate piezoelectric micromachined ultrasonic transducer (pMUT) arrays with an application-specific integrated circuit (ASIC) using thermocompression or eutectic/solder bonding. In an aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using thermocompression, wherein any set of individual PMUTs of PMUT array is addressable. In another aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using eutectic or solder bonding, wherein any set of individual PMUTs of the PMUT array is addressable.

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Patent Owner(s)

Patent OwnerAddress
EXO IMAGING INC240D TWIN DOLPHIN DRIVE REDWOOD CITY CA 94065

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akkaraju, Sandeep Wellesley, US 61 436
Bircumshaw, Brian Oakland, US 38 225

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