Lesion resection method

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12262939
APP PUB NO 20230218336A1
SERIAL NO

17575183

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Abstract

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A lesion resection method includes a marking step of forming a three-dimensional marking in peripheral tissues of a lesion; a grasping step of grasping the lesion by a grasping forceps; a retracing step of pulling the marking to a hand side of a staple ejection position of a stapler by pulling the grasping forceps grasping the lesion; a ligating step of ejecting a staple from the stapler to ligate the peripheral tissues of the lesion; and a resecting step of resecting the lesion.

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Patent Owner(s)

Patent OwnerAddress
OLYMPUS CORPORATION2951 ISHIKAWA-MACHI HACHIOJI-SHI TOKYO 1928507 ?1928507

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Higuchi, Tatsuya Yokohama, JP 63 207

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