Heat pipe for improved thermal performance at cold plate interface
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United States of America
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Mar 25, 2025
Grant Date -
May 6, 2021
app pub date -
Dec 18, 2020
filing date -
Dec 18, 2020
priority date (Note) -
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Abstract
Disclosed embodiments are relate to heat transfer devices or heat exchangers for computing systems, and in particular, to heat pipes for improved thermal performance at a cold plate interface. A thermal exchange assembly includes a heat pipe (HP) directly coupled to a cold plate. The HP includes a window, which is a recessed or depressed portion of the HP. The window is attached to the cold plate at a window section of the cold plate. The cold plate is configured to be placed on a semiconductor device that generates heat during operation. The cold plate transfers the heat to the HP with less thermal resistance than existing HP solutions. Other embodiments may be described and/or claimed.
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