Computing devices with improved thermal management
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United States of America
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Mar 25, 2025
Grant Date -
Apr 18, 2024
app pub date -
Oct 18, 2022
filing date -
Oct 18, 2022
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Abstract
Devices, apparatuses, systems, and methods are provided for improved thermal management in networking computing devices. An example thermal management apparatus includes a housing defining a first end and a second end opposite the first end. The apparatus further includes an electronic component supported within the housing, such as a GPU. The apparatus includes a primary inlet that receives a primary airflow having a first temperature and a secondary inlet that receives a secondary airflow having a second temperature where the second temperature is different than the first temperature. The primary airflow and the secondary airflow are collectively configured to dissipate heat generated by the electronic component.
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