Copper-clad laminate and method of forming the same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12262468
APP PUB NO 20220039256A1
SERIAL NO

17443386

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Abstract

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The present disclosure relates to a copper-clad laminate that may include a copper foil layer and a dielectric coating overlying the copper foil layer. The dielectric coating may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The dielectric coating may have an average thickness of not greater than about 20 microns.

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Patent Owner(s)

Patent OwnerAddress
SAINT-GOBAIN PERFORMANCE PLASTICS IRELAND LIMITEDKILRUSH INDUSTRIAL PARK KILRUSH

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Adamchuk, Jennifer Marlborough, US 16 48
Besozzi, Theresa M Milford, US 6 22
Buss, Gerard T Bedford, US 23 103

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