Stacked acoustic wave (AW) filter packages, including cross-talk reduction layers, and related fabrication methods

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12261583
APP PUB NO 20230253950A1
SERIAL NO

17649965

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Abstract

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A stacked AW filter package includes a first substrate stacked on a second substrate. The first substrate has a first AW filter circuit on first surface and a metal layer on a second surface. The second substrate has a second AW filter circuit disposed in a cavity between the metal layer of the first substrate and a third surface of the second substrate. The metal layer is coupled to the second AW filter circuit by a metal interconnect formed in a metallization layer on a side surface of the first substrate. The metal layer provides isolation to reduce cross-talk (e.g., electromagnetic interference) within the stacked AW filter package between the first AW filter circuit and the second AW filter circuit. Including the metal layer in the stacked AW filter package improves signal quality of transmitted and received signals filtered in the first and second AW filter circuits.

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Patent Owner(s)

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RF360 SINGAPORE PTE LTD80 ROBINSON ROAD #02-00 SINGAPORE 068898

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Colasanti, Simone Bayern, DE 3 0
Erhard-Egeler, Nadine Munich, DE 2 0
Hatzl, Stefan Leopold Kloech, AT 10 8
Hofer, Manuel Graz, AT 9 3
Kirchhofer, Peter Munich, DE 3 5
Schulz, Volker Munich, DE 21 245

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