Radio frequency module and communication device
Number of patents in Portfolio can not be more than 2000
United States of America
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Mar 25, 2025
Grant Date -
Aug 31, 2023
app pub date -
May 3, 2023
filing date -
May 3, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
The radio frequency module includes a module substrate, an electronic component disposed on a main surface, a resin member covering at least part of the main surface and at least part of a side surface of the electronic component, and a metal shield layer that is formed on a surface of the resin member and is set to a ground potential. The electronic component has a top surface in contact with the metal shield layer, a bottom surface facing the main surface, a circuit portion formed at a position closer to the bottom surface than to the top surface, and a metal layer formed between the metal shield layer and the circuit portion. The metal layer is a barrier metal.
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