Semiconductor device package and method of manufacturing the same
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
Mar 25, 2025
Grant Date -
Dec 14, 2023
app pub date -
Aug 8, 2023
filing date -
Aug 8, 2023
priority date (Note) -
In Force
status (Latency Note)
Importance
Loading Importance Indicators... 
Abstract
A semiconductor device package is provided that includes a substrate, a first support structure disposed on the substrate and a first antenna. The first support structure includes a first surface spaced apart from the substrate by a first distance. The first antenna is disposed above the first surface of the first support structure. The first antenna has a first surface, a second surface opposite the first surface and a third surface extending from the first surface to the second surface, wherein the first surface and the second surface of the first antenna are exposed.
First Claim
Other Claims data not available
Family
Loading Family data...
International Classification(s)
- 2023 Application Filing Year
- H01L Class
- 19835 Applications Filed
- 4214 Patents Issued To-Date
- 21.25 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- < 1 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Sep 25, 2028 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Sep 25, 2032 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 25, 2036 |