Molded dies in semiconductor packages and methods of forming same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12261163
APP PUB NO 20220328467A1
SERIAL NO

17383971

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Abstract

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A package includes an interposer having a first redistribution structure; a first die directly bonded to a first surface of the first redistribution structure with a dielectric-to-dielectric bond and a metal-to-metal bond; a second die directly bonded to the first surface of the first redistribution structure with a dielectric-to-dielectric bond and a metal-to-metal bond; an encapsulant around the first die and the second die; and a plurality of conductive connectors on a second side of the first redistribution structure opposite to the first die and the second die.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Hsien-Wei Hsinchu, TW 976 9710
Chen, Jie New Taipei, TW 1059 5911
Chen, Ming-Fa Taichung, TW 524 4489

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