Semiconductor packages including antenna pattern

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12261135
APP PUB NO 20230215824A1
SERIAL NO

18182111

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Importance

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Abstract

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A semiconductor package having a thinner shape and including an antenna is provided. A semiconductor package comprises a first substrate, a second substrate on the first substrate and including a first face facing the first substrate and a second face opposite to the first face, a pillar extending from the second face of the second substrate to the first substrate, and a first semiconductor chip on the second face of the second substrate and connected to the pillar. The second substrate may include an antenna pattern, and the antenna pattern may be connected to the first semiconductor chip, and may be on the second face of the second substrate such that the antenna pattern is isolated from direct contact with the first semiconductor chip.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDGYEONGGI DO SOUTH KOREA GYEONGGI-DO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Hyeong Seob Cheonan-si, KR 7 193
Mok, Seung Kon Seoul, KR 5 169
You, Se Ho Seoul, KR 2 2

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