Application of conductive via or trench for intra module EMI shielding

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12261127
APP PUB NO 20220310530A1
SERIAL NO

17655801

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A packaged semiconductor module comprises a substrate having a ground plane, an electronic device mounted on a surface of the substrate, a bond pad disposed on the surface of the substrate and electrically connected to the ground plane, a mold compound covering the electronic device, a conductive post disposed on a side of the electronic device, the conductive post extending from the bond pad and at least partially through the mold compound, and a conductive layer disposed on the mold compound and electrically coupled to the conductive post and to the ground plane, the conductive post, the conductive layer, and the ground plane together forming the integrated electromagnetic interference shield, the conductive post extending from the bond pad to the conductive layer in a direction perpendicular to a plane defined by the surface of the substrate.

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Patent Owner(s)

Patent OwnerAddress
SKYWORKS SOLUTIONS INC5260 CALIFORNIA AVENUE IRVINE CA 92617

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Howard E Anaheim, US 83 913
Lee, Ki Wook Irvine, US 64 499
Liu, Yi San Diego, US 838 10296
LoBianco, Anthony James Irvine, US 85 1206
Nguyen, Hoang Mong Fountain Valley, US 80 1262
Read, Matthew Sean Foothill Ranch, US 57 839

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