Optical packaging structure and backlight module having the same

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United States of America

PATENT NO 12259110
SERIAL NO

18808295

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Abstract

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The present disclosure provides an optical packaging structure and a backlight module with the optical packaging structure. The optical packaging structure includes a light-emitting chip, a packaging layer, a fluorescent layer, a lens structure, and a reflecting layer. The light-emitting chip includes a light-emitting surface, a connecting surface, and a side surface. The packaging layer covers the light-emitting surface and the first side surface. The connecting surface is exposed from the packaging layer. The fluorescent layer is disposed on the packaging layer, and covers on the light-emitting surface and the first side surface. The lens structure is disposed on a top surface of the fluorescent layer. A surface of the lens structure is recessed towards the light-emitting chip to form a curved surface. The reflecting layer is disposed on the curved surface.

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Patent Owner(s)

Patent OwnerAddress
ADVANCED OPTOELECTRONIC TECHNOLOGY INCNO 13 GONGYE 5TH RD HSINCHU INDUSTRIAL PARK HUKOU TOWNSHIP HSINCHU COUNTY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hsieh, Chuang-Yu Hsinchu, TW 4 27
Hsieh, Hao-Hsiang Hsinchu, TW 1 0
Hung, Hsin-Ting Hsinchu, TW 1 0
Lo, Shih-Hsiang Hsinchu, TW 12 36

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