Method and system for fabricating a MEMS device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12258266
APP PUB NO 20230037849A1
SERIAL NO

17877089

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Importance

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Abstract

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A method includes forming a bumpstop from a first intermetal dielectric (IMD) layer and forming a via within the first IMD, wherein the first IMD is disposed over a first polysilicon layer, and wherein the first polysilicon layer is disposed over another IMD layer that is disposed over a substrate. The method further includes depositing a second polysilicon layer over the bumpstop and further over the via to connect to the first polysilicon layer. A standoff is formed over a first portion of the second polysilicon layer, and wherein a second portion of the second polysilicon layer is exposed. The method includes depositing a bond layer over the standoff.

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Patent Owner(s)

Patent OwnerAddress
INVENSENSE INC1745 TECHNOLOGY DRIVE SUITE 200 SAN JOSE CA 95110

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cuthbertson, Alan San Jose, US 103 1205
Lee, Daesung San Jose, US 160 2240

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