Substrate and microphone unit

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12258262
APP PUB NO 20220219968A1
SERIAL NO

17607696

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The present invention provides a substrate that is highly resistant to ESD, on which a reverse sound hole type MEMS microphone can be mounted. The substrate has one surface connected to a MEMS microphone, and comprises a substrate sound hole that penetrates through the substrate and communicates with a sound hole of the MEMS microphone, and a GND pad disposed around the substrate sound hole on another surface of the substrate.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
HOSIDEN CORPORATION4-33 KITAKYUHOJI 1-CHOME OSAKA YAO-SHI 5810071

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Okano, Shingo Osaka, JP 18 2

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Sep 25, 2028
7.5 Year Payment $3600.00 $1800.00 $900.00 Sep 25, 2032
11.5 Year Payment $7400.00 $3700.00 $1850.00 Sep 25, 2036
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00