Lead-free piezo composites and methods of making thereof
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United States of America
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Mar 18, 2025
Grant Date -
Jun 9, 2022
app pub date -
Mar 31, 2020
filing date -
Mar 31, 2020
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Abstract
Methods of producing lead-free piezoelectric composites are described. The method can include adding a lead-free piezoelectric additive to a solution that includes a solvent and polymer solubilized therein. The solvent can have i) a boiling point ≥80° C. at 0.1 MPa and ii) a solubility in water of ≥0.1 g/g and/or a dielectric constant ≥20. The solvent can be removed to form a polymeric matrix having the lead-free piezoelectric particles dispersed therein. Electrical treatment of the polymeric matrix can form the piezoelectric component. Lead-free piezoelectric composites and devices that include the lead-free piezoelectric composites are also described.
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