Semiconductor package structure comprising via structure and redistribution layer structure

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12255166
APP PUB NO 20240047403A1
SERIAL NO

18484609

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Abstract

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A semiconductor package structure includes a conductive pad formed over a substrate. The semiconductor package structure also includes a passivation layer formed over the conductive pad. The semiconductor package structure further includes a first via structure formed through the passivation layer and in contact with the conductive pad. The semiconductor package structure also includes a first encapsulating material surrounding the first via structure. The semiconductor package structure further includes a redistribution layer structure formed over the first via structure. The first via structure has a lateral extending portion embedded in the first encapsulating material near a top surface of the first via structure, and the lateral extending portion has a width increasing in a direction toward the redistribution layer structure.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Neng-Chieh Tainan, TW 2 0
Cheng, Ming-Da Taoyuan, TW 447 4774
Liu, Hsu-Lun Tainan, TW 13 1
Lu, Wen-Hsiung Tainan, TW 127 2473
Tsai, Po-Hao Taoyuan, TW 263 4589

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