Cell structure with intermediate metal layers for power supplies

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12255142
APP PUB NO 20230387015A1
SERIAL NO

18448005

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Abstract

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A cell on an integrated circuit is provided. The cell includes: a fin structure; an intermediate fin structure connection metal track disposed in an intermediate fin structure connection metal layer above the fin structure, the intermediate fin structure connection metal track being connected to the fin structure; and a first intermediate gate connection metal track disposed in an intermediate gate connection metal layer above the intermediate fin structure connection metal layer, the first intermediate gate connection metal track being connected to the intermediate fin structure connection metal track. A first power supply terminal is connected to the first intermediate gate connection metal track.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chih-Liang Hsinchu, TW 301 1501
Chen, Shun Li Hsinchu, TW 43 181
Chen, Ting Yu Hsinchu, TW 48 197
Tien, Li-Chun Tainan, TW 276 2262
Zhuang, Hui-Zhong Kaohsiung, TW 306 953

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