Capacitor between two passivation layers with different etching rates
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United States of America
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Mar 18, 2025
Grant Date -
Nov 23, 2023
app pub date -
Aug 3, 2023
filing date -
Aug 3, 2023
priority date (Note) -
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Abstract
A method includes depositing a first passivation layer over a conductive feature, wherein the first passivation layer has a first dielectric constant, forming a capacitor over the first passivation layer, and depositing a second passivation layer over the capacitor, wherein the second passivation layer has a second dielectric constant greater than the first dielectric constant. The method further includes forming a redistribution line over and electrically connecting to the capacitor, depositing a third passivation layer over the redistribution line, and forming an Under-Bump-Metallurgy (UBM) penetrating through the third passivation layer to electrically connect to the redistribution line.
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