Test key and semiconductor die including the same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12255112
APP PUB NO 20230290694A1
SERIAL NO

17693439

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Abstract

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A test key configured to measure resistance of a through semiconductor via in a semiconductor substrate is provided. The test key includes a first resistor, a first conductor, a first probe pad, a second conductor, a second probe pad, a third conductor, a third probe pad, a fourth conductor, and a fourth probe pad. The first probe pad is electrically connected to a first end of the through semiconductor via by the first resistor and the first conductor. The second probe pad is electrically connected to the first end of the through semiconductor via by the second conductor. The third probe pad is electrically connected to a second end of the through semiconductor via by the third conductor. The fourth probe pad is electrically connected to the second end of the through semiconductor via by the fourth conductor.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Jen-Yuan Hsinchu, TW 175 215
Lee, Wei Hsinchu, TW 40 140
Lu, Kuo-Pei Hsinchu County, TW 2 2
Yang, Tse-Pan Hsinchu, TW 2 0

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