Lid carveouts for processor connection and alignment

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12253892
APP PUB NO 20230315171A1
SERIAL NO

17704912

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Importance

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Abstract

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Package lids with carveouts configured for processor connection and alignment are described. Lid carveouts are configured to align and mechanically secure a cooling device to the package lid by receiving protrusions of the cooling device. Because the lid carveouts ensure precise alignment and orientation of a cooling device relative to a package lid, the lid design enables targeted cooling of discrete portions of the lid. Lid carveouts are further configured to expose one or more connectors disposed on a surface that supports package internal components. When contacted by corresponding connectors of a cooling device, the lid carveouts enable direct connections between the package and the attached cooling device. By creating a direct connection between package components and an attached cooling device, the lid carveouts enable a high-speed connection for proactive and on-demand cooling actuation.

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Patent Owner(s)

Patent OwnerAddress
ADVANCED MICRO DEVICES INC2485 AUGUSTINE DRIVE SANTA CLARA CA 95054

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ahrens, Jerry Anton Sister Bay, US 20 14
Alverson, William Robert Del Valle, US 21 14
Harwani, Anil Austin, US 33 19
Knight, Joshua Taylor Georgetown, US 21 17
Ley, Grant Evan Eden, US 20 14
Mehra, Amitabh Fort Collins, US 43 63

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