Chemical mechanical polishing apparatus and method
Number of patents in Portfolio can not be more than 2000
United States of America
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Mar 18, 2025
Grant Date -
Nov 30, 2023
app pub date -
Aug 9, 2023
filing date -
Aug 9, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
The present disclosure describes an apparatus and a method to detect a polishing pad profile during a polish process and adjust the polishing process based on the detected profile. The apparatus can include a polishing pad configured to polishing a substrate, a substrate carrier configured to hold the substrate against the polishing pad, and a detection module configured to detect a profile of the polishing pad. The detection module can include a probe configured to measure a thickness of one or more areas on the polishing pad, and a beam configured to support the probe, where the probe can be further configured to move along the beam.
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