Endoscope tip assembly using truncated trapezoid cavity interposer to allow coplanar camera and LEDs in small-diameter endoscopes
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United States of America
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Mar 18, 2025
Grant Date -
Apr 20, 2023
app pub date -
May 18, 2022
filing date -
May 18, 2022
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Abstract
A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.

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Patent Owner(s)
Patent Owner | Address | |
---|---|---|
OMNIVISION TECHNOLOGIES INC | 4275 BURTON DRIVE SANTA CLARA CA 95054 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Chen, Teng-Sheng | Hsinchu, TW | 21 | 107 |
Chen, Wei-Ping | New Taipei, TW | 35 | 148 |
Deng, Jau-Jan | Taipei, TW | 75 | 462 |
Lin, Wei-Feng | Hsinchu, TW | 83 | 537 |
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