Circuit board manufacturing method and circuit board manufacturing device
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
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Mar 11, 2025
Grant Date -
Nov 3, 2022
app pub date -
Jun 18, 2019
filing date -
Jun 18, 2019
priority date (Note) -
In Force
status (Latency Note)
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Abstract
In a method for manufacturing a circuit board according to an additive manufacturing shaping method, a circuit board manufacturing method and a circuit board manufacturing device that can reduce the influence of thermal stress on a circuit board by reducing the number of heating steps are provided. A circuit board manufacturing method according to the present disclosure includes a board shaping step of laminating and shaping a circuit board having a wiring on a peeling member adhered to a base member, an attachment step of attaching a metal paste contacting the wiring to the circuit board, an electronic component arrangement step of arranging an electronic component on the circuit board to arrange the electronic component and the wiring via the metal paste, and a heating press step of arranging a press member above the circuit board, and causing the peeling member to be easily released from the base member and curing the metal paste by collectively heating the peeling member and the metal paste while pressing the circuit board with the base member and the press member to correct warpage of the circuit board.
First Claim
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Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Sep 11, 2028 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Sep 11, 2032 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 11, 2036 |