Substrate structure and cutting method thereof

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United States of America

PATENT NO 12250776
APP PUB NO 20240357748A1
SERIAL NO

18317756

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Abstract

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A substrate structure and a cutting method thereof are provided. The cutting method includes the following steps. A first substrate structure is provided, wherein the first substrate structure includes a glass substrate and a redistribution layer disposed on the glass substrate. A laser process is performed on the glass substrate to form a modified region on the glass substrate. A wet etching process is performed on the modified region of the glass substrate to remove the modified region and form a plurality of second substrate structures.

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Patent Owner(s)

  • UNIMICRON TECHNOLOGY CORP.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ko, Cheng-Ta Taoyuan, TW 78 166
Kuo, Chi-Hai Taoyuan, TW 18 4
Li, Jeng-Ting Taoyuan, TW 6 1
Lin, Pu-Ju Taoyuan, TW 51 13

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