Sensor interposer employing castellated through-vias

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12250768
APP PUB NO 20240049388A1
SERIAL NO

18381074

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An example sensor interposer employing castellated through-vias formed in a PCB includes a planar substrate defining a plurality of castellated through-vias; a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via; a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via, the second castellated through-via electrically isolated from the first castellated through-via; and a guard trace formed on the planar substrate, the guard trace having a first portion formed on a first surface of the planar substrate and electrically coupling a third castellated through-via to a fourth castellated through-via, the guard trace having a second portion formed on a second surface of the planar substrate and electrically coupling the third castellated through-via to the fourth castellated through-via, the guard trace formed between the first and second electrical contacts to provide electrical isolation between the first and second electrical contacts.

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Patent Owner(s)

  • DEXCOM, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Frick, Sean San Francisco, US 22 161
Jung, Louis Foster City, US 23 98
Lari, David San Francisco, US 23 471

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