Radio frequency module and communication device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12250017
APP PUB NO 20230006708A1
SERIAL NO

17930834

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A radio frequency module includes a mounting substrate, a first electronic component, a second electronic component, a resin layer, and a shield layer. The resin layer covers outer peripheral surfaces of the first electronic component and the second electronic component. The first electronic component includes a first substrate having first and second main surfaces opposed to each other, and a first circuit section formed on the first main surface side of the first substrate. The second electronic component includes a second substrate having first and second main surfaces opposed to each other, and a second circuit section formed on the first main surface side of the second substrate. A material of the first substrate and a material of the second substrate are the same. The shield layer is in contact with the second main surface of the first substrate and the second main surface of the second substrate.

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Patent Owner(s)

  • MURATA MANUFACTURING CO LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kitajima, Hiromichi Kyoto, JP 70 66
Matsumoto, Naoya Kyoto, JP 115 470
Nakagawa, Dai Kyoto, JP 37 71
Okabe, Ryohei Kyoto, JP 8 2
Takematsu, Yuji Kyoto, JP 44 108
Uejima, Takanori Kyoto, JP 177 735

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