Integrated assemblies comprising vertically-stacked decks with interconnected conductive lines
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United States of America
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Mar 11, 2025
Grant Date -
Oct 27, 2022
app pub date -
Jul 11, 2022
filing date -
Jul 11, 2022
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Abstract
Some embodiments include an integrated assembly having a base supporting first circuitry and first conductive lines. The first conductive lines extend along a first direction and are associated with the first circuitry. A deck is over the base and supports an array of memory cells and second conductive lines which are associated with the array of memory cells. The second conductive lines extend along a second direction which is substantially orthogonal to the first direction. Vertical interconnects extend from the deck to the base and couple the first conductive lines to the second conductive lines. Each of the vertical interconnects couples one of the first conductive lines to one of the second conductive lines. Each of the second conductive lines is coupled with only one of the first conductive lines.
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