Film structure for bond pad

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12249586
APP PUB NO 20220254744A1
SERIAL NO

17729363

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Abstract

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The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes an interconnect structure disposed over a substrate. The interconnect structure includes a plurality of interconnect layers disposed within a dielectric structure. A bond pad structure is disposed over the interconnect structure. The bond pad structure includes a contact layer. A first masking layer including a metal-oxide is disposed over the bond pad structure. The first masking layer has interior sidewalls arranged directly over the bond pad structure to define an opening. A conductive bump is arranged within the opening and on the contact layer.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Yao-Wen Taipei, TW 209 1504
Tsai, Tzu-Chung Hsinchu County, TW 34 50
Wu, Chii Ming Taipei, TW 14 56
Yang, Julie Hsin-Chu, TW 7 8

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