Selective deposition of carbon on photoresist layer for lithography applications

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12249509
APP PUB NO 20230377890A1
SERIAL NO

18228234

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Abstract

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A method for etching a hardmask layer includes forming a photoresist layer comprising an organometallic material on a hardmask layer comprising a metal-containing material, exposing the photoresist layer to ultraviolet radiation through a mask having a selected pattern, removing un-irradiated areas of the photoresist layer to pattern the photoresist layer, forming a passivation layer comprising a carbon-containing material selectively on a top surface of the patterned photoresist layer, and etching the hardmask layer exposed by the patterned photoresist layer having the passivation layer formed thereon.

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Patent Owner(s)

  • APPLIED MATERIALS INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fung, Nancy Livermore, US 29 850
Gao, Larry Fremont, US 5 5

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