Semiconductor chip and test method of the same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12248018
APP PUB NO 20230176112A1
SERIAL NO

18047366

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Importance

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Abstract

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A semiconductor chip includes a semiconductor device connected between a first node to which a power supply voltage is applied and a second node to which a ground voltage is applied, a first ring oscillator connected to the first node through a first supply switch and the second node through a first ground switch and a second ring oscillator connected to the first node through a second supply switch and the second node through a second ground switch, wherein the first supply and ground switches are configured to operate in response to a first control signal, thereby operating the first ring oscillator, and the second supply and ground switches are configured to operate in response to a second control signal, thereby operating the second ring oscillator.

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Byun, Do Hoon Hwaseong-si, KR 4 2
Choi, Hwang Ho Busan, KR 6 29
Choi, Jae Seung Hwaseong-si, KR 43 439
Jung, Yeon Ho Suwon-si, KR 6 6
Kim, Mi Joung Hwaseong-si, KR 2 0
Kwak, Min Woo Seoul, KR 2 0
Kye, Jong Wook Suwon-si, KR 2 0
Lee, Jae Ho Incheon, KR 283 2617
Lee, Kwan Seong Yongin-si, KR 2 0
Park, Chan Wook Seongnam-si, KR 7 3

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