Method for producing a probe used for testing integrated electronic circuits

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12248012
APP PUB NO 20240012029A1
SERIAL NO

18371823

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Importance

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Abstract

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Cantilever probes are produced for use in a test apparatus of integrated electronic circuits. The probes are configured to contact corresponding terminals of the electronic circuits to be tested during a test operation. The probe bodies are formed of electrically conductive materials. On a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region is formed having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe.

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Patent Owner(s)

  • STMICROELECTRONICS S.R.L.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Pagani, Alberto Nova Milanese, IT 145 1141

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